Core Technologies - Electronics manufacturing plant in Berg
To realize complex assemblies on a tight space, we are also able to offer to you the following technologies:- SMT assembly and THT assembly
- Chip-on-Board, Chip-on-Flex, Chip-on-Chip
- Fully automatic SMD high-speed and fine assembly
- Flip-chip, CSP, BGA
- Selective soldering
- Pressfit technology
- Microelectronics production in clean rooms
- Flexible printed board assembly
- Electronic-glass combinations
- Complete assemblies
- Test procedures such as ICT, AOI, Boundary Scan
- Traceability at component level
Our services enable you to reduce your time-to-market periods and save project costs by coordinating your production with just one partner. |
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